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An integrated circuit that adjusts to damage shows a way to make ordinary chips more efficient and reliable.
The three-dimensional transistors of Intel’s new generation of chips continue the 50-year trend of faster, more tightly packed chips.
IBM and 3M aim to make ultrafast three-dimensional chips that can stay cool enough to be practical in consumer products.
New processors are a big improvement, but it will take time for apps to take advantage.
Researchers make transistors out of a material that’s better than silicon.
A smarter credit card could mean new security features and other functionality.
A probability-based processor may speed up flash memory, and eventually much more.
Replacing metal wiring with fiber optics could change everything from supercomputers to laptops.
A new manufacturing approach could end the junking of several chips when one fails.
The machine will use an unfashionable chip design.