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Lithography Past Light's Limits

Continued from page 1

By Katherine Bourzac

Friday, November 07, 2008

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Plasmonic lithography is "a technology that bears looking at because we need better solutions for sub-20-nanometer lithography than we have today," says John Hartley, director of the Advanced Lithography Center at the University of Albany's College of Nanoscale Science and Engineering. In optical lithography, light shines through a mask--a type of stencil--onto a substrate, such as a silicon wafer, that's coated with a light-sensitive chemical called a photoresist. The photoresist hardens where the light strikes it; elsewhere, it can be rinsed away, reproducing the pattern of the mask. It's possible to make finer features by using shorter-wavelength light, but this approach quickly becomes impractical, says Zhang. Shorter-wavelength light has higher energy, and producing it requires expensive lasers or, in the case of extreme ultraviolet light, a synchrotron. Other technologies, such as electron beams, can etch very fine features without masks, but they're slow. The Berkeley flying lens is much faster and will become faster still, says Zhang, when the number of plasmonic lenses in an array is increased from the current 16 to 100,000.

So far, the Berkeley researchers have demonstrated that they can use the technology to etch 80-nanometer lines. This is large compared with the best optical-lithography techniques currently in use. However, Zhang says, engineering the distance-control system was the hard part. Making the concentrators smaller, for example, will increase the technique's resolution.

But higher-resolution light beams won't do much good without a new generation of photoresists that can resolve features that are only five nanometers or so across; the photoresists on the market were designed to work with wider beams of light. Zhang says that he is currently collaborating with chemists to address this problem.

Zhang says that the air-bearing design could also enable other applications of plasmonics, particularly high-resolution imaging. "If we can print 50 nanometers, we can image 50 nanometers," he says. The flying lenses could be used as probes for evaluating the quality of computer chips or for biological imaging, allowing biologists to watch processes unfolding in living cells at the molecular level.

Zhang is in the process of spinning out a company to develop the technology and has been contacted by major semiconductor companies, he says.

Comments

  • If's and But's
    Currently wafers are lithographed in sections called flash fields where multiple die are exposed through a mask using a stepper. An entire 300 mm (12")wafer might be 30 flash fields.

    Issue number one is the ability of this technology to scan at a rate comparable to using EUV and the more conventional flash field masking lithography.

    Issue number two is the planarization of the wafer and defects. The surface of the wafer is not flat, the air bearings will encounter topography that at the 20nm level will resemble the contours of Appalachia. You might be able to fly a 747 2 millimeters above Kansas, but you are NOT in Kansas Toto. Even worse, there are defects including particles and when your scanner hits a full micron sized piece o' stuff- what then? Planarization would have to come a very long way, and for sub-20nm features would need to be employed 50 times or more during the process just using mask based litho, scanning would demand far more planarization. You could count on this technology in fact requiring an entirely new planarization scheme.

    Third if you are scanning a spinning wafer with sub 20nm features there would have to be incredible registration and isolation control. The fab floor moves, the tool sets move, the wafer carrier would have noise, good luck cancelling all of that to hit the other side of a half drawn gate on the next revolution of a 12" wafer with a lower level of defect than competing technologies.

    The decrease in feature size is in no way going to be led by a scanning technology, IMO because the economies of scale are far more important in semiconductor manufacturing than the extreme capabilities of a single technology. The industry will move into 400mm wafer sizes. Where is the pay-off for reinventing lithography and planarization. The equipment companies behind current planar and litho technologies are not likely to develop this "novel" approach, and a new entry into this sphere would be disruptive and opposed.
    Rate this comment: 12345

    rlindsl
    11/07/2008
    Posts:19
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