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A different advanced method of cooling chips involves using pipes to pump liquid coolant throughout the system, similar to the way a car's engine is cooled. Apple's new Mac Pro desktop computer, for instance, uses a pump that pushes water through pipes. But these water-cooling systems are complex and expensive, Mamishev says.
The ion pump is a "potentially important enhancement," says Thomas Kenny, professor of mechanical engineering at Stanford University. But he adds that it's still unknown whether the system will face economic and technical challenges similar to those with water-cooled systems.
Mamishev's team is not alone in the use of ion pumps to cool chips. Similar technology developed at Purdue University in West Lafayette, IN, is being commercialized by a startup called Thorrn Micro Technologies. Their approach is to use metal wires instead of a silicon tip, says Suresh Garimella, professor of mechanical engineering at Purdue. Applying a strong voltage along the wire creates an electric field that ionizes air along its length, not just at the tip, he explains. The company is developing a system for cooling laptops and other portable devices.
Mamishev says there will be challenges with his group's technology as they try to integrate an ion pump into an actual product. Because of the high voltages used to generate the cooling effect, there could be an accumulation of static charge, hindering device performance, or the voltage could break down insulation in parts of the circuit. "You have to be careful," he says. Also, the group needs to do tests to determine the longevity and reliability of the ion pump.
The researchers are currently developing a prototype ion pump, which is built into a heat sink. Mamishev expects the technology to be ready for commercialization in servers, desktop computers, and laptops within two years.
I have a 12 volt cooling/heating insulated travel box that I bought maybe 15 years ago that uses a semiconductor that heats or cools depending on the direction of the current flow. Why wasn't that cooling property ever used to cool uP chips by clamping that cooling chip directly on top of the uP. Too much current needed?
Score: Fans (1) : new Cooling Technology (0)
Unfortunately, with the market flooded with dirt cheap fans this new air-moving technology has some very hard competition. Regardless of its benefits, smaller size, quieter operation, focused jets of air, it still is operating on the same principle of cooling being forces air convection, which has already hit its cooling limits. Imagine this, no matter how hard you blow on an electrical stove coil, it will still be very hot, regards of wither you use your standard fan or your ionic breeze (basically what this tech is).
Thermodynamic pioneers at companies like Intel and IBM have realized this and are now looking at other methods of cooling like liquids, liquid-metals, and solid-state, and companies like Dell have already switched to more expensive heat pipes for their higher power cooling needs.
The problem with this technology is that is not solving the markets major dilemma, how to cool smaller higher power electronics, it just changes the look and the feel of the fan.
Nice try, but I say the score is Fans (1), new air cooling technologies (0).
Brian Glassman
Innovation Management
Commercialization of technology
Manufacturing in the United States is in trouble. That's bad news not just for the country's economy but for the future of innovation.
This document is part of the “How-To Guide for Most Common Measurements” centralized resource portal. This tutorial provides a detailed guide for measurement and device considerations to take temperature measurements using thermocouples. Get an introduction to thermocouples, which are inexpensive sensing devices widely used with PC-based data acquisition systems. Also review some specific thermocouple examples and learn how thermocouples work and ways to integrate them into a data acquisition measurement system.
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Phineas
127 Comments
Lifter Tech
Why does this remind me of Thomas Townsend Brown's lifters and the enhanced airflow over the B2 wing?
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