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Hardware
Materials scientist Matthias Mllenborn and his team at Sound Holding create the sound-sensing component of the microphone by etching a rectangular hollow beneath a silicon chip's surface, leaving a 500-nanometer-thick membrane of silicon on top. Sound waves hitting the membrane cause it to vibrate, generating an electrical signal that travels to an adjacent chip for processing. The team cuts manufacturing costs by using a commercially available processing chip and gluing it side by side with the sound sensor on a bigger slice of silicon. The whole package is five cubic millimeters, one-tenth the size of a cell phone microphone.
Engineers have been working on silicon microphones for almost a decade, but manufacturing difficulties have hurt the devices' performance, preventing them from reaching the market. Sound Holding's manufacturing method should solve that problem, but observers are not sure it will be a commercial home run. "If only performance and size counts, Sound Holding's approach is good," says Robert Aigner, an electrical engineer at Munich, Germany's Infineon Technologies, which also develops silicon microphones. "The challenge will be to compete with the low prices of conventional microphones." Sound Holding is pushing ahead, though. The consortium is equipping cell phones with prototypes and plans to start commercial production in 2003.
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